Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)
European Commission · Horizon Europe
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- European Commission · Horizon Europe
- Award amount
- €3,000,000 – €5,000,000
- Deadline
- March 18, 2027
- Eligible countries
- European Union, United Kingdom, Norway, Iceland, Switzerland, Israel, Global
Summary
Forthcoming EU call topic HORIZON-CL4-2027-05-DIGITAL-EMERGING-03 · HORIZON Research and Innovation Actions. Part of call HORIZON-CL4-2027-05: DIGITAL. Opens 2026-11-17; next deadline 2027-03-18. Topic page: https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/HORIZON-CL4-2027-05-DIGITAL-EMERGING-03
Expected Outcome: - Advanced integrated photonic devices and circuits with enhanced functionality and performance enabling wider application across multiple sectors including digital, automotive, industrial, health and security - Reinforced competitiveness of EU photonics actors by demonstrating advancements in representative system configurations and validating real-world applicability - Significantly improved performance of electro-optic systems in applications such as communication, computing, sensing, medical diagnostics, data processing, AI supporting the introduction of photonic elements into such systems - Low power consumption sensors with increased performance in application domains
Scope: R&I should enhance the functionality, efficiency, and integration of photonic devices and circuits with a focus extended system performance. Action should address at least two of the following aspects. - Enhanced performance through improved spectral purity, wavelength coverage, output power and noise characteristics. - Increased modulation or detection speeds going beyond the capability of existing PIC material platforms, improved signal-processing capabilities, and integration of novel materials such as thin-film LiNbO3, BTO, graphene, silicon carbide, phase change materials and TMDCs. - Miniaturised, high-complexity photonic circuits (e.g. multilayer photonics, chiplets, multiple integrated functional elements), scalable interconnects and electronics-photonics integration (co-packaged, heterogeneous, or monolithic) to improve performance, reliability, and cost-efficiency. - Reduction of power consumption for example through…
Summary as listed by the funder. Always read the full announcement for eligibility, limits and how to apply.
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