International collaboration EU and Japan on semiconductors
- Funder
- European Commission · Digital Europe Programme
- Award amount
- €3,000,000 – €5,000,000
- Deadline
- December 8, 2026
- Eligible countries
- European Union
Summary
Open EU call topic DIGITAL-JU-CHIPS-2026-SG-JAPAN · DIGITAL JU Simple Grants. Part of call DIGITAL-JU-CHIPS-2026-SG-JAPAN: DIGITAL-JU-CHIPS-2026-SG-JAPAN. Next deadline 2026-12-08. Topic page: https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/DIGITAL-JU-CHIPS-2026-SG-JAPAN
Expected Outcome: Projects are expected to contribute to the following expected outcomes: - Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
- Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem
Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
Summary as listed by the funder. Always read the full announcement for eligibility, limits and how to apply.
Read the full announcement →What European Union reviewers look for
- Most Horizon Europe calls score three criteria (the ERC uses excellence alone). Excellence: clarity and ambition of the objectives, and the soundness of the methodology.
- Impact: credible pathways to the expected outcomes, and measures to communicate and exploit results.
- Quality and efficiency of implementation: the work plan, resources and the consortium's capacity.
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